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Area Array Package Design

by Gilleo, Ken

$142.01

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Description

This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

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Product Details

  • Oct 24, 2003 Pub Date:
  • 0071737731 ISBN-10:
  • 9780071737739 ISBN-13:
  • English Language