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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

by Suhir, Ephraim

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Description

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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Product Details

  • CRC Press Brand
  • Oct 4, 2024 Pub Date:
  • 0367635887 ISBN-10:
  • 9780367635886 ISBN-13:
  • English Language
  • 9.21 in * 0.84 in * 6.14 in Dimensions:
  • 1 lb Weight: