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Wafer Level 3-D ICS Process Technology (2009)
by Wafer Level 3-D ICS Process Technology (2009)
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Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
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Product Details
- Springer Brand
- Sep 19, 2008 Pub Date:
- 0387765328 ISBN-10:
- 9780387765327 ISBN-13:
- English Language
- 422.0 pages Hardcover
- 9.3 in * 0.9 in * 6.2 in Dimensions:
- 1 lb Weight:
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