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Semiconductor Packaging: Materials Interaction and Reliability

by Chen, Andrea

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Description

This easy-to-read book enables a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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Product Details

  • CRC Press Brand
  • Apr 10, 2017 Pub Date:
  • 113807540X ISBN-10:
  • 9781138075405 ISBN-13:
  • 216.0 pages Paperback
  • English Language
  • 9.21 in * 6.14 in * 0.46 in Dimensions:
  • 1 lb Weight: