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Advanced Wirebond Interconnection Technology
by [Prasad, Shankara K.]
$333.14
Description
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
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Product Details
- Springer Brand
- Apr 30, 2004 Pub Date:
- 9781402077623 ISBN-13:
- 1402077629 ISBN-10:
- 698.0 pages Hardcover
- English Language
- 9.04 in * 1.51 in * 6.66 in Dimensions:
- 2 lb Weight:
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