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Electrical Design of Through Silicon Via

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$114.84

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Description

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

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Product Details

  • Springer Brand
  • Sep 27, 2016 Pub Date:
  • 9789401779494 ISBN-13:
  • 940177949X ISBN-10:
  • English Language
  • 9.25 in * 0.66 in * 6.1 in Dimensions:
  • 1 lb Weight: