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Fan-Out Wafer-Level Packaging (2018)

by Fan-Out Wafer-Level Packaging (2018)

$160.95

List Price: $169.99
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Product Details

  • Springer Brand
  • Apr 13, 2018 Pub Date:
  • 9811088837 ISBN-10:
  • 9789811088834 ISBN-13:
  • English Language
  • 324.0 pages Hardcover
  • 9.21 in * 0.95 in * 6.14 in Dimensions:
  • 1 lb Weight: